FPC Boards Prototype PCB Assembly Carbon Ink Through Hole Assembly
TU862
Prototype PCB Assembly Description:
1. From prototype to production.
2. 2-68 layers board fabrication.
3. TPS Lean production and high reliability.
4. IATF16949, UL certification.
Prototype PCB Assembly Parameters:
| SMT Capability | 14 million spots per day |
| SMT Lines | 12 SMT lines |
| Reject Rate | R&C: 0.3% |
| IC: 0% |
| PCB Board | POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base
boards |
| Parts Dimension | Min BGA Footprint:03015 Chip/0.35mm BGA |
| Parts SMT Accuracy:±0.04mm |
| IC SMT Accuracy:±0.03mm |
| PCB Dimension | Size:50*50mm-686*508mm |
| Thickness: 0.3-6.5mm |
Prototype PCB Assembly Introduction:
1. After the electronic equipment adopts printed boards, due to the
consistency of similar printed boards, manual wiring errors are
avoided, and automatic insertion or mounting of electronic
components, automatic soldering, and automatic detection can be
realized, which ensures electronic products. quality, improve labor
productivity, reduce costs, and facilitate maintenance.
2. Provide the required electrical characteristics, characteristic
impedance, and electromagnetic compatibility characteristics for
the circuit in high-speed or high-frequency circuits.
3. The printed board with passive components embedded inside
provides certain electrical functions, simplifies the electronic
installation procedure, and improves the reliability of the
product.
4. In large-scale and ultra-large-scale electronic packaging
components, an effective chip carrier is provided for the
miniaturized chip packaging of electronic components.
