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Rogers Full Turnkey Pcb Assembly Immersion Gold OSP Carbon Ink Pcb Assembly Pcba

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TONGZHAN INDUSTRIAL LIMITED

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Rogers Full Turnkey Pcb Assembly Immersion Gold OSP Carbon Ink Pcb Assembly Pcba

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Price :	Negotiable
Payment Terms :	T/T
Supply Ability :	100000pc/Month
Delivery Time :	4 Weeks
Brand Name :	CUSTOM MADE
Certification :	ISO/UL

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Rogers Full Turnkey Pcb Assembly Immersion Gold OSP Carbon Ink Pcb Assembly Pcba

One-Stop Turnkey PCB Assembly Immersion Gold + OSP High-Layer Carbon Ink

Turnkey PCB Assembly Description:

1. A team of experts with more than 10 years of experience.
2. Professional component certified engineers and experienced supply chain management team.
3. Pay attention to the latest international market information and provide competitive prices.
4. Certified suppliers and parts.

Turnkey PCB Assembly Parameters:

Item	Technical Parameter
Layer	2-64
Thickness	0.3-6.5mm
Copper Thickness	0.3-12 oz
Min Mechanical Hole	0.1mm
Min Laser Hole	0.075mm
HDI	1+n+1,2+n+2,3+n+3
Max Aspect Ratio	20:01
Max Board Size	650mm*1130mm
Min Width/Space	2.4/2.4mil
Min Outline Tolerance	±0.1mm
Impedance Tolerance	±5%
Min PP Thickness	0.06mm
Bow &Twist	≤0.5%
Materials	FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
Surface Finished	HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special Capability	Gold Finger Plating, Peelable, Carbon ink

Turnkey PCB Assembly Introduction:

1. designability
Requirements for various properties of PCB (electrical, physical, chemical, mechanical, etc.) can be achieved through design standardization, normalization, etc. In this way, the design time is short and the efficiency is high.
2. producibility
PCB adopts modern management, which can realize standardization, scale (quantization), and automatic production, so as to ensure the consistency of product quality.

Rogers Full Turnkey Pcb Assembly Immersion Gold OSP Carbon Ink Pcb Assembly Pcba

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Rogers Full Turnkey Pcb Assembly Immersion Gold OSP Carbon Ink Pcb Assembly Pcba