Versatile PCB Manufacturing High Precision and Customization
PCB Manufacturing Introduction:
Experience cutting-edge PCB fabrication with a wide range of
insulation materials including FR4, aluminum, copper, ceramic, PI,
and PET. Our factory specializes in 1 to 12-layer boards with
finished plate thickness starting from 0.07mm and above, ensuring
precision with a tolerance of +5%/-6%. Inner layer copper thickness
ranges from 18-70μm, and outer layer copper thickness from
20-140μm, guaranteeing optimal performance.
Choose from an array of solder resistance options, vibrant
lettering, and surface treatments like anti-oxidation, HASL,
immersion gold, and more. Unleash innovation with specialized
processes such as thick copper plating, impedance control, and
single-layer copper foil gold finger plates. Our products can be
reinforced with materials like FR4, steel, and electromagnetic
shielding film.
Discover the versatility of PCBs with a maximum size of 50mm x
100mm, maintaining precision with outer/inner line width and
spacing of 0.065mm/3mil. Our products meet the highest standards
with minimum solder resist ring width, solder bridge width, solder
mask window, and aperture requirements. Impedance tolerance is
maintained at 10%, and shape tolerances are set at +0.05mm G laser
+0.005mm.
Choose from forming methods including V-cut, CNC, and punching to
meet your fabrication needs. Join us in shaping the future of
electronics with our precise, customizable, and high-quality PCB
offerings.
PCB Manufacturing Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
PCB Manufacturing Process:
1. Gold-plating process: the vertical HASL process is very
difficult to flatten very thin pads, which brings difficulty to SMT
placement. In addition, the shelf life of the HASL is very short,
and gold-plating just solves the problem. these problems.
2. Immersion gold process: The purpose of the immersion gold
process is to deposit a nickel-gold coating with stable color, good
brightness, flat coating and good solderability on the surface of
the printed circuit board. Basically, it can be divided into four
stages: pre-treatment (oil extraction, micro-etching, activation,
post-immersion), nickel immersion, gold immersion, and
post-treatment (waste gold washing, DI washing, drying)
3. Leaded HASL: Leaded eutectic temperature is lower than
lead-free, the specific amount depends on the composition of the
lead-free alloy, such as the total gold of SNAGCU 217 degrees, the
soldering temperature is the eutectic immersion plus 30 degrees or
50 degrees, It depends on the actual adjustment, the lead eutectic
is 183 degrees, the mechanical strength, brightness, etc. are
better than lead-free.
4. Lead-free HASL: lead will increase the activity of tin wire in
the soldering process, lead-tin wire is better than lead-free tin
wire, but lead is poisonous, long-term use is not good for human
health, and lead-free tin will It is brighter than lead-tin
melting, so the solder joint is much stronger.
5. SOP (anti-oxidation): It has anti-oxidation, thermal shock
resistance, and corrosion resistance. It is used to protect the
copper surface from rusting (oxidation or carbonization) in a
normal environment: but in the subsequent welding high temperature,
this protection The film must be easily removed quickly by the flux
so that the exposed clean copper surface can be melted and soldered
immediately in a short time to become a firm solder joint.
PCB Manufacturing Advantages:
1. From PCB proofing to SMT placement, one-stop solution, reducing
R&D costs and accelerating product launch.
2. Quick quotation and quick response.
3. The delivery date is fast, and the on-time delivery rate is over
95%
4. Excellent materials, advanced equipment, and strict quality
system 5. Exclusive customer service one-to-one service, seamless
connection throughout the process
