Advanced PCB Manufacturing: Diverse Materials & Specialized
Processes
PCB Manufacturing Introduction:
Experience the forefront of PCB manufacturing with our
comprehensive range of materials, from FR4 to aluminum, copper,
ceramic, PI, and PET substrates. Our factory excels in producing
boards spanning 1 to 12 layers, boasting a finished plate thickness
of 0.07mm and above (with a tolerance of +5%/-6%). With inner layer
copper thickness ranging from 18-70μm and outer layer copper
thickness from 20-140μm, our products guarantee exceptional
performance.
Choose from an array of solder-resist colors and lettering options,
and enhance your PCB's functionality with surface treatments like
anti-oxidation, HASL, immersion gold, and more. Unlock innovation
with specialized processes such as thick copper plating, impedance
control, and the creation of single-layer copper foil gold finger
plates with varying sides for versatility.
Strengthen your designs with reinforcement options including Pl,
FR4, steel sheets, M glue, and electromagnetic shielding film. Our
precision extends to compact dimensions, offering a maximum size of
50mm x 100mm, with outer and inner line width/spacing of
0.065mm/3mil. Our commitment to detail is evident in adhering to
minimum requirements for solder resist ring width, solder bridge
width, solder mask window, and aperture.
Count on our products to maintain impedance tolerance within 10%
and shape tolerance within +0.05mm G laser +0.005mm. Our flexible
forming methods include V-cut, CNC, and punching. Join us in
shaping the future of electronics with these precise, versatile,
and dynamic PCB offerings.
PCB Manufacturing Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
PCB Manufacturing Process:
1. Gold-plating process: the vertical HASL process is very
difficult to flatten very thin pads, which brings difficulty to SMT
placement. In addition, the shelf life of the HASL is very short,
and gold-plating just solves the problem. these problems.
2. Immersion gold process: The purpose of the immersion gold
process is to deposit a nickel-gold coating with stable color, good
brightness, flat coating and good solderability on the surface of
the printed circuit board. Basically, it can be divided into four
stages: pre-treatment (oil extraction, micro-etching, activation,
post-immersion), nickel immersion, gold immersion, and
post-treatment (waste gold washing, DI washing, drying)
3. Leaded HASL: Leaded eutectic temperature is lower than
lead-free, the specific amount depends on the composition of the
lead-free alloy, such as the total gold of SNAGCU 217 degrees, the
soldering temperature is the eutectic immersion plus 30 degrees or
50 degrees, It depends on the actual adjustment, the lead eutectic
is 183 degrees, the mechanical strength, brightness, etc. are
better than lead-free.
4. Lead-free HASL: lead will increase the activity of tin wire in
the soldering process, lead-tin wire is better than lead-free tin
wire, but lead is poisonous, long-term use is not good for human
health, and lead-free tin will It is brighter than lead-tin
melting, so the solder joint is much stronger.
5. SOP (anti-oxidation): It has anti-oxidation, thermal shock
resistance, and corrosion resistance. It is used to protect the
copper surface from rusting (oxidation or carbonization) in a
normal environment: but in the subsequent welding high temperature,
this protection The film must be easily removed quickly by the flux
so that the exposed clean copper surface can be melted and soldered
immediately in a short time to become a firm solder joint.
PCB Manufacturing Advantages:
1. From PCB proofing to SMT placement, one-stop solution, reducing
R&D costs and accelerating product launch.
2. Quick quotation and quick response.
3. The delivery date is fast, and the on-time delivery rate is over
95%
4. Excellent materials, advanced equipment, and strict quality
system 5. Exclusive customer service one-to-one service, seamless
connection throughout the process
